Spec. No. : C858K3
Issued Date : 2014.11.24
Revised Date :
CYStech Electronics Corp.
Page No. : 6/8
TO-92L Taping Outline
Millimeters
Max.
5.10
8.20
4.10
0.55
0.80
13.00
12.90
6.65
2.80
1.00
19.00
6.50
9.50
1.00
21.00
16.50
-
DIM
Item
Min.
A1
A
T
d
d1
P
P0
P2
F1, F2
△h
W
W0
W1
W2
H
H0
L1
D0
t1
Component body width
Component body height
Component body thickness
Lead wire diameter
Lead wire diameter 1
Pitch of component
4.70
7.80
3.70
0.35
0.60
12.40
12.50
6.05
2.20
-1.00
17.50
5.50
8.50
-
19.00
15.50
2.50
3.80
0.35
0.15
3.55
-1.00
Feed hole pitch
Hole center to component center
Lead to lead distance
Component alignment, F-R
Tape width
Hole down tape width
Hole position
Hole down tape position
Height of component from tape center
Lead wire clinch height
Lead wire (tape portion)
Feed hole diameter
4.20
0.45
0.25
4.15
1.00
Taped lead thickness
Carrier tape thickness
Position of hole
t2
P1
△P
Component alignment
BTC2328AK3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
