Spec. No. : C356C3
Issued Date : 2011.11.03
Revised Date : 2014.03.04
Page No. : 6/6
CYStech Electronics Corp.
SOT-523 Dimension
Marking:
Date
Code
Device
Code
29
3-Lead SOT-523 Plastic
Surface Mounted Package
CYStek Package Code: C3
Style: Pin 1.Base
(Input)
2.Emitter (Ground)
3.Collector (Output)
*: Typical
Inches
DIM
Millimeters
Inches
Millimeters
DIM
Min.
Max.
0.035
0.004
0.031
0.010
0.014
0.008
0.067
Min.
Max.
0.900
0.100
0.800
0.250
0.350
0.200
1.700
Min.
0.028
0.057
Max.
0.035
0.069
Min.
0.700
1.450
Max.
0.900
1.750
A
A1
A2
b1
b2
c
0.028
0.000
0.028
0.006
0.010
0.004
0.059
0.700
0.000
0.700
0.150
0.250
0.100
1.500
E
E1
e
e1
L
0.020*
0.500*
0.035
0.043
0.900
1.100
0.016 REF
0.400 REF
L1
θ
0.010
0.018
0.260
0.460
0°
8°
0°
8°
D
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DTC115EC3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
