BZX84C2V4 - BZX84C39
300mW SURFACE MOUNT ZENER DIODE
Features
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Planar Die Construction
300mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly
Processes
TOP VIEW
SOT-23
A
Dim
A
B
C
Min
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013
0.903
0.45
0.085
0°
Max
0.51
1.40
2.50
1.03
0.60
2.05
3.00
0.10
1.10
0.61
0.180
8°
B
C
D
E
G
M
L
Mechanical Data
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Case: SOT-23, Molded Plastic
Case material - UL Flammability Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: See Diagram
Marking: Marking Code & Date Code
(See Page 4)
Weight: 0.008 grams (approx.)
E
D
G
H
K
J
H
J
K
L
M
a
All Dimensions in mm
Maximum Ratings
Forward Voltage
Power Dissipation (Note 1)
@ T
A
= 25°C unless otherwise specified
Symbol
@ I
F
= 10mA
V
F
P
d
R
qJA
T
j,
T
STG
Value
0.9
300
417
-65 to +150
Unit
V
mW
°C/W
°C
Characteristic
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
2. Short duration test pulse used to minimize self-heating effect.
3. f = 1KHz.
DS18001 Rev. 18 - 2
1 of 4
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BZX84C2V4 - BZX84C39
DIODES [ DIODES INCORPORATED ]
