ES3A/AB - ES3D/DB
3.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
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Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Low Forward Voltage Drop and High Current Capability
Surge Overload Rating to 100A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 4)
B
Dim
A
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
SMC
Min
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
A
C
B
C
D
Mechanical Data
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Case: SMB/SMC
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Mounting Position: Any
Ordering Information: See Page 3
Marking: Type Number, See Page 3
SMB Weight: 0.093 grams (approximate)
SMC Weight: 0.21 grams (approximate)
D
J
E
G
H
H
G
E
J
All Dimensions in mm
A, B, C, D, Suffix Designates SMC Package
AB, BB, CB, DB Suffix Designates SMB Package
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 100°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
(JEDEC Method)
Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage
Reverse Recovery Time (Note 3)
Typical Total Capacitance (Note 2)
Typical Thermal Resistance, Junction to Terminal (Note 1)
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4
@ T
A
= 25°C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
t
rr
C
T
R
qJT
T
j,
T
STG
ES3A/AB
50
35
ES3B/BB
100
70
3.0
100
0.9
10
500
25
45
15
ES3C/CB
150
105
ES3D/DB
200
140
Unit
V
V
A
A
V
mA
ns
pF
°C/W
°C
@ I
F
= 3.0A
@ T
A
= 25°C
@ T
A
= 125°C
-65 to +150
Unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pads as heat sink.
Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See Figure 5.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
DS14003 Rev. 10 - 2
1 of 3
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ES3A/AB - ES3D/DB
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