MMBZ5221B - MMBZ5259B
350mW SURFACE MOUNT ZENER DIODE
Features
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Planar Die Construction
350mW Power Dissipation on FR-4 PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 2 and 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
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Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.008 grams (approximate)
Top View
Device Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Forward Voltage
Characteristic
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Notes:
Symbol
P
D
R
θ
JA
T
J,
T
STG
Value
350
357
-65 to +150
Unit
mW
°C/W
°C
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf
2. No purposefully added lead. Halogen and Antimony Free.
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
MMBZ5221B - MMBZ5259B
Document number: DS18011 Rev. 21 - 2
1 of 5
August 2010
© Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
