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MMDT5401 参数 Datasheet PDF下载

MMDT5401图片预览
型号: MMDT5401
PDF下载: 下载PDF文件 查看货源
内容描述: 双PNP小信号表面贴装晶体管 [DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR]
分类和应用: 晶体晶体管
文件页数/大小: 4 页 / 164 K
品牌: DIODES [ DIODES INCORPORATED ]
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MMDT5401
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
Epitaxial Planar Die Construction
Complementary NPN Type Available (MMDT5551)
Ideal for Medium Power Amplification and Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
A
C
2
B
1
E
1
SOT-363
Dim
B C
Min
0.10
1.15
2.00
0.30
1.80
0.90
0.25
0.10
Max
0.30
1.35
2.20
0.40
2.20
0.10
1.00
0.40
0.25
A
B
C
D
F
M
E
2
B
2
C
1
Mechanical Data
Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
Terminal Connections: See Diagram
Marking Information: K4M, See Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.006 grams (approximate)
K
G
H
0.65 Nominal
H
J
K
L
M
α
J
D
F
L
All Dimensions in mm
Maximum Ratings
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current – Continuous
Power Dissipation
@T
A
= 25°C unless otherwise specified
Symbol
V
CBO
V
CEO
V
EBO
(Note 1)
(Note 1,2)
(Note 1)
I
C
P
d
R
θ
JA
T
j
, T
STG
Value
-160
-150
-5.0
-200
200
625
-55 to +150
Unit
V
V
V
mA
mW
°C/W
°C
Characteristic
Thermal Resistance, Junction to Ambient
Operating and Storage and Temperature Range
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30169 Rev. 9 - 2
1 of 4
www.diodes.com
MMDT5401
© Diodes Incorporated