MMSZ5221B - MMSZ5259B
Features
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500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)
"Green" Device (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
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Case: SOD-123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Ordering Information: See Page 3
Marking Information: See Page 3
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings
Forward Voltage
@T
A
= 25°C unless otherwise specified
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Characteristic
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @T
L
= 75°C
Thermal Resistance, Junction to Ambient Air (Note 1)
Thermal Resistance, Junction to Lead (Note 2)
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4.
Symbol
P
D
R
θ
JA
R
θ
JL
T
J,
T
STG
Value
500
350
150
-65 to +150
Unit
mW
°C/W
°C/W
°C
Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.
Thermal Resistance measurement obtained via infrared scan method.
No purposefully added lead. Halogen and Antimony Free.
Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
MMSZ5221B - MMSZ5259B
Document number: DS18010 Rev. 23 - 2
1 of 5
May 2009
© Diodes Incorporated