PDR3G
3A GLASS PASSIVATED RECTIFIER
PowerDI
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5
Features
NEW PRODUCT
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Glass Passivated Die Construction
Low Leakage Current
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
L1
e
L1
D
b2
A
A2
PowerDI
ä
5
E
Dim
E1
Min
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
A
A2
b1
Mechanical Data
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Case: PowerDI
ä
5
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture sensitivity: Level 1 per J-STD-020C
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking: See Page 3
Weight: 0.095 grams (approx.)
b1
D
D2
b2
b1
A2
b2
D
D2
3.05 NOM
1.84 NOM
3.55 NOM
L
E2
E
E
e
E1
E2
L
L1
BOTTOMSIDE
HEAT SINK
e
3
W
L1
e
b1
LEFT PIN
RIGHT PIN
b1
W
All Dimensions in mm
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See also figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
T
j
T
STG
Value
400
283
3
100
-65 to +150
-65 to +150
Unit
V
V
A
A
°C
°C
Thermal Characteristics
Characteristic
@ T
A
= 25°C unless otherwise specified
Symbol
R
qJS
R
qJA
R
qJA
R
qJA
Typ
¾
75
65
45
Max
2.0
¾
¾
¾
Unit
°C/W
°C/W
°C/W
°C/W
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Notes:
1.
2.
3.
4.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30547 Rev. 6 - 2
PowerDI is a trademark of Diodes Incorporated.
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PDR3G
ã
Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
