SPICE MODEL: PDS1040
PDS1040
10A SCHOTTKY BARRIER RECTIFIER
PowerDI
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5
Features
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Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
Low Forward Voltage Drop
Very Low Leakage Current
High Forward Surge Current Capability
For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Applications
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
LEFT PIN
RIGHT PIN
NEW PRODUCT
D
b2
L1
A
A2
PowerDI
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5
Dim
A
A2
Min
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
E
E1
b1
b2
D
L1
e
BOTTOMSIDE
b1
HEAT SINK
Mechanical Data
Case: PowerDI
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5
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
Moisture sensitivity: Level 1 per J-STD-020C
Terminals: Finish – Matte Tin annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
e
3
Polarity: See Diagram
Marking: See Page 3
Weight: 0.096 grams (approx.)
b1
D
D2
b2
L
E2
E
A2
D2
E
e
E1
E2
L
L1
W
3.05 NOM
1.84 NOM
3.55 NOM
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
W
L1
e
b1
b1
All Dimensions in mm
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (see also Figure 5)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Operating Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
T
j
T
STG
@ T
A
= 25°C unless otherwise specified
Symbol
R
qJS
R
qJA
R
qJA
R
qJA
Typ
¾
95
75
50
Max
2.0
¾
¾
¾
Unit
°C/W
°C/W
Value
40
28
10
275
-65 to +150
-65 to +150
Unit
V
V
A
A
°C
°C
Thermal Characteristics
Characteristic
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
Notes:
1.
2.
3.
4.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Polyimide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30538 Rev. 4 - 2
PowerDI is a trademark of Diodes Incorporated.
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PDS1040
ã
Diodes Incorporated
DIODES [ DIODES INCORPORATED ]
