A Product Line of
Diodes Incorporated
ZXLD1366
Block Diagram
D1
V
IN
L1
RS
I
V
5
4
SENSE
1
LX
IN
5V
R1
C1
4.7µF
Voltage
regulator
-
+
0.2V
Low voltage
detector
-
+
MN
-
Adj
3
+
R5
20K
R4
50K
600KHz
R2
R3
D1
1.25V
-
+
1.35V
Gnd
2
Figure. 1 Pin Connection for TSOT25 Package
Pin Description
Name
LX
TSOT25
V-DFN3030-6
SO-8EP
1
Function
1
2
1
Drain of NDMOS switch
Ground (0V)
GND
2, 5
2, 3, 6, 7
Multi-function On/Off and brightness control pin:
•
Leave floating for normal operation.(VADJ = VREF = 1.25V giving nominal
average output current IOUTnom = 0.2V/RS
)
•
•
Drive to voltage below 0.2V to turn off output current
Drive with DC voltage (0.3V < VADJ < 2.5V) to adjust output current from 25%
to 200% of IOUTnom
ADJ
3
3
4
•
Connect a capacitor from this pin to ground to set soft-start time.
Soft start time increases approximately 0.2ms/nF
Connect resistor RS from this pin to VIN to define nominal average output current
IOUTnom = 0.2V/RS
.
ISENSE
4
5
4
6
5
8
(Note: RSMIN = 0.2V with ADJ pin open-circuit)
Input Voltage (6V to 60V). Decouple to ground with 4.7µF of higher X7R ceramic
capacitor close to device.
VIN
Exposed Pad (EP) - connected to device substrate.
To improve thermal impedance of package the EP must be connected to power
ground but should not be used as the 0V (GND) current path.
It can be left floating but must not be connected to any other voltage other than
0V.
Pad
-
Pad
Pad
2 of 30
www.diodes.com
May 2012
© Diodes Incorporated
ZXLD1366
Document number: DS31992 Rev. 7 - 2
DIODES [ DIODES INCORPORATED ]
