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EL400CS 参数 Datasheet PDF下载

EL400CS图片预览
型号: EL400CS
PDF下载: 下载PDF文件 查看货源
内容描述: 200MHz的电流反馈放大器 [200MHz Current Feedback Amplifier]
分类和应用: 消费电路商用集成电路音频放大器视频放大器光电二极管
文件页数/大小: 11 页 / 427 K
品牌: ELANTEC [ ELANTEC SEMICONDUCTOR ]
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EL400C  
200MHz Current Feedback Amplifier  
Features  
General Description  
• 200MHz -3dB bandwidth, AV = 2  
• 12ns settling to 0.05%  
• VS = ±5V @ 15mA  
• Low distortion: HD2, HD3 @  
-60dBc at 20MHz  
• Differential gain 0.02% at NTSC,  
PAL  
The EL400C is a wide bandwidth, fast settling monolithic amplifier  
built using an advanced complementary bipolar process. This ampli-  
fier uses current-mode feedback to achieve more bandwidth at a given  
gain than conventional operational amplifiers. Designed for closed-  
loop gains of ±1 to ±8, the EL400C has a 200MHz -3dB bandwidth  
(AV = +2), and 12ns settling to 0.05% while consuming only 15mA of  
supply current.  
• Differential phase 0.01° at NTSC,  
PAL  
• Overload/short-circuit protected  
• ±1 to ±8 closed-loop gain range  
• Low cost  
The EL400C is an obvious high-performance solution for video distri-  
bution and line-driving applications. With low 15mA supply current,  
differential gain/phase of 0.02%/0.01°, and a minimum 50mA output  
drive, performance in these areas is assured.  
The EL400's settling to 0.05% in 12ns, low distortion, and ability to  
drive capacitive loads make it an ideal flash A/D driver. The wide  
200MHz bandwidth and extremely linear phase allow unmatched sig-  
nal fidelity. D/A systems can also benefit from the EL400C, especially  
if linearity and drive levels are important.  
• Direct replacement for CLC400  
Applications  
• Video gain block  
• Video distribution  
• HDTV amplifier  
• High-speed A/D conversion  
• D/A I-V conversion  
• Photodiode, CCD preamps  
• IF processors  
• High-speed communications  
Ordering Information  
Part No.  
EL400CN  
EL400CS  
Temp. Range  
-40°C to +85°C  
-40°C to +85°C  
Package  
8-Pin P-DIP  
8-Lead SO  
Outline #  
MDP0031  
MDP0027  
Connection Diagrams  
DIP and SO Package  
Top View  
Manufactured under U.S. Patent No. 4,893,091  
Note: All information contained in this data sheet has been carefully checked and is believed to be accurate as of the date of publication; however, this data sheet cannot be a “controlled document”. Current revisions, if any, to these  
specifications are maintained at the factory and are available upon your request. We recommend checking the revision level before finalization of your design documentation.  
© 2001 Elantec Semiconductor, Inc.