He
epc134/epc135/epc136/epc137/epc138/epc139
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.
Packaging Information (all measures in mm)
Tape & Reel Information
The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch)
reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the
tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA) standard
481-1, 481-2, 481-3.
CSP6 Tape
QFN16 Tape
Pin 1
Pin 1
2
8
epc does not guarantee that there are no empty cavities.
Thus, the pick-and-place machine should do check the presence of a chip during picking.
Order Information
Part Number
epc134-CSP6
Package
CSP6
RoHS compliance
Packaging Method
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
epc134-QFN16
epc135-CSP6
epc135-QFN16
epc136-CSP6
epc136-QFN16
epc137-CSP6
epc137-QFN16
epc138-CSP6
epc138-QFN16
epc139-CSP6
epc139-QFN16
QFN16
CSP6
QFN16
CSP6
QFN16
CSP6
QFN16
CSP6
QFN16
CSP6
QFN16
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
10
Datasheet epc13x digital - V2.1
www.espros.ch
EPC [ ESPROS PHOTONICS CORP ]
