He
epc701/epc703
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.
Packaging Information (all measures in mm)
Tape & Reel Information
The devices are packaged into embossed tapes for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13
inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indic-
ate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA)
standard 481-1, 481-2, 481-3.
CSP6 Tape
QFN16 Tape
Pin 1
Pin 1
2
8
epc does not guarantee that there are no empty cavities in the tape. Thus, the pick-and-place machine should check the presence of a chip
during picking.
Ordering Information
Part Number
epc700-CSP6
epc700-QFN16
epc701-CSP6
epc701-QFN16
epc702-CSP6
epc702-QFN16
epc703-CSP6
epc703-QFN16
Package
CSP6
RoHS compliance
Packaging Method
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Reel
Reel
Reel
Reel
Reel
Reel
Reel
Reel
QFN16
CSP6
QFN16
CSP6
QFN16
CSP6
QFN16
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
10
Datasheet epc701_703 - V2.2
www.espros.ch
EPC [ ESPROS PHOTONICS CORP ]
