Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
B572**V2
Electrical specification and ordering codes
R
25
Ω
470
3.3 k
4.7 k
4.7 k
10 k
22 k
33 k
47 k
No. of R/T
characteristic
8501
8502
8501
8502
8502
8506
8506
8502
B
25/50
K
3500
3940
3500
3940
3940
4473
4473
3940
B
25/85
K
3540
3980
3540
3980
3980
4548
4548
3980
B
25/100
K
3550
±3%
4000
±3%
3550
±3%
4000
±3%
4000
±3%
4575
±3%
4575
±3%
4000
±3%
Ordering code
B57211V2471J060
B57221V2332J060
B57211V2472J060
B57221V2472J060
B57221V2103J060
B57261V2223J060
B57261V2333J060
B57221V2473J060
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
Test conditions
∆R
25
/R
25
(typical)
< 2%
Remarks
Storage in damp
heat, steady state
Rapid temperature
cycling
Endurance
Solderability
Storage at upper
category temperature
T: (125
±2) °C
t: 1000 h
IEC
Temperature of air: (40
±2) °C
60068-2-78 Relative humidity of air:
JIS C 0022 (93 +2/ 3)%
Duration: 56 days
IEC
Lower test temperature: 55
°C
60068-2-14 Upper test temperature: 125
°C
JIS C 0025 Number of cycles: 100
P
max
: 150 mW
T: (65
±2) °C
t: 1000 h
IEC
Solderability:
60068-2-58 (215
±3) °C,
(3
±0.3)
s
JIS C 0054 (235
±5) °C,
(2
±0.2)
s
Resistance to soldering heat:
(260
±5) °C,
(10
±1)
s
Reflow soldering profile
< 2%
< 2%
< 2%
95% of
terminations
wetted
Resistance drift
after soldering
< 1%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 3 of 18
EPCOS [ EPCOS ]
