Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
B574**V2
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
Test conditions
∆R
25
/R
25
(typical)
< 2%
Remarks
Storage in damp
heat, steady state
Rapid temperature
cycling
Endurance
Solderability
Storage at upper
category temperature
T: (125
±2) °C
t: 1000 h
IEC
Temperature of air: (40
±2) °C
60068-2-78 Relative humidity of air:
JIS C 0022 (93 +2/ 3)%
Duration: 56 days
IEC
Lower test temperature: 55
°C
60068-2-14 Upper test temperature: 125
°C
JIS C 0025 Number of cycles: 100
P
max
: 210 mW
T: (65
±2) °C
t: 1000 h
IEC
Solderability:
60068-2-58 (215
±3) °C,
(3
±0.3)
s
JIS C 0054 (235
±5) °C,
(2
±0.2)
s
Resistance to soldering heat:
(260
±5) °C,
(10
±1)
s
Reflow soldering profile
Wave soldering profile
< 2%
< 2%
< 2%
95% of
terminations
wetted
Resistance drift
after soldering
< 1%
Please read
Cautions and warnings
and
Important notes
at the end of this document.
Page 4 of 20
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