Package Dimensions (Through Hole)
PIN 1
ID.
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
3
2
1
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.200 (5.08)
0.165 (4.18)
0.016 (0.41)
0.008 (0.20)
0.020 (0.51)
0.154 (3.90)
0.100 (2.54)
MIN
0.020 (0.51)
MIN
0.016 (0.40) MIN
0.016 (0.40)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.315 (8.00)
MIN
0.300 (7.62)
TYP
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.405 (10.30)
MAX
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
Package Dimensions (0.4"Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.004 (0.10)
MIN
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
TYP
0.100 (2.54) TYP
Note
All dimensions are in inches (millimeters)
5
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H11AA1, H11AA3, H11AA2, H11AA4 Rev. 1.0.0
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
