ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DRAIN-SOURCE DIODE CHARACTERISTICS
I
S
I
SM
V
SD
Notes:
1. R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is guaranteed by
design while R
θ
CA
is determined by the user's board design.
Maximum Continuous Source Current
Maximum Pulse Source Current
(Note 2)
Drain-Source Diode Forward Voltage
V
GS
= 0 V, I
S
= 0.51 A
(Note 2)
0.8
0.51
1.5
1.2
A
A
V
P
D
(
t
) =
R
θ
J A
t
)
(
T
J
−
T
A
=
R
θ
J C
R
θ
CA
t
)
+
(
T
J
−
T
A
=
I
2
(
t
) ×
R
DS
(
ON
)
D
T
J
Typical R
θ
JA
for single device operation using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 130
o
C/W when mounted on a 0.125 in
2
pad of 2oz cpper.
b. 140
o
C/W when mounted on a 0.005 in
2
pad of 2oz cpper.
c. 180
o
C/W when mounted on a 0.0015 in
2
pad of 2oz cpper.
1a
1b
1c
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
NDC7002N.SAM
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
