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GBU610 参数 Datasheet PDF下载

GBU610图片预览
型号: GBU610
PDF下载: 下载PDF文件 查看货源
内容描述: 6.0安培玻璃钝化单相硅铝ñ桥 [6.0Amps Glass Passivated Single Phase Silico n Bridge]
分类和应用:
文件页数/大小: 2 页 / 127 K
品牌: FCI [ FIRST COMPONENTS INTERNATIONAL ]
 浏览型号GBU610的Datasheet PDF文件第2页  
6.0Amps Glass Passivated
Single Phase Silicon Bridge
Machamical Dimensions
Descriptions
3.85
+
0.25
2
21.9
+
0.5
4.4
+
0.2
1.95
+
0.25
18.6
+
0.3
20.4
+
0.3
4.2
+
0.2
GBU600~612
_
1.9 R. TYP.
(2PLACES)
~ ~ +
10.8
+
0.5
3.4
+
0.2
16.0
+
0.4
1.3
+
0.2
GBU
5.1
+
0.5
Dimensions in millimeters(1mm =0.0394")
Features
Ideal for P.C. Board mounting
High surge current capability
This series is UL listed under the Recognized
Component Index, file number E142814
The plastic material used carries Underwriters
Laboratory flammability recognition 94V-0
High temperature soldering guaranteed 265 C /10
seconds at 5 lbs (2.3kg) tension
Mechanical Data
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Mounting Position:: Any
Weight: 3.8 grams (approx)
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
GBU
Parameter
Symbol
GBU GBU GBU GBU GBU GBU GBU 612
unit
600
601 602
604
606 608 610
V
RRM
100 200
400
600 800 1000 1200 V
50
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
Maximum average forward rectified
output current at T
A
=100 C
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing ( t<8.3ms)
Typical thermal resistance per element
(1)
Operating junction and storage temperature
range
Max. instantaneous forward voltage drop
per leg at 6.0A
Max. DC reverse current at rated Ta=25C
Max. DC reverse current at rated Ta=125C
V
RMS
V
DC
I
F(AV)
I
FSM
I t
R
eJA
T
J
,
T
STG
VF
IR
IR
2
35
50
70
100
140
200
280
400
6.0
175
127
2.2
420
600
560
800
700
840
V
V
A
A
A
sec
C/W
2
1000 1200
-55 to + 150
1.1
5.0
500
V
uA
uA
Notes: Thermal resistance from Junction to Ambient on PC board mounting