FMP1617CC0(7)
CMOS LPRAM
PACKAGE DIMENSION
Unit : millimeters
48 BALL FINE PITCH BGA(0.75mm ball pitch)
Top View
B
Bottom View
A1 INDEX MARK
B
B1
0.05
0.05
6
5
4
3
2
1
A
B
C
D
#A1
E
F
G
H
B/2
Side View
D
Detail A
A
Y
C
-
A
Min
-
Typ
0.75
6.00
3.75
8.00
Max
-
NOTES.
1. Bump counts : 48(8row x 6column)
2. Bump pitch : (x,y)=(0.75 x 0.75)(typ.)
3. All tolerance are +/-0.050 unless
otherwise specified.
B
5.90
-
6.10
-
B1
C
7.90
8.10
4. Typ : Typical
5. Y is coplanarity : 0.08(Max)
C1
D
-
5.25
0.35
1.10
0.85
0.25
-
-
0.30
0.40
1.20
-
E
-
E1
E2
Y
-
0.20
-
0.30
0.08
Revision 0.1
Jun. 2006
10