Mechanical Data and Ordering Information
16.2 Mechanical Dimensions of the PBGA Package
Figure 69 shows the mechanical dimensions of the PBGA package.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/870VRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/870ZTXXX.
Figure 69. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
81
FREESCALE [ Freescale ]
