Package Description
9
Package Description
Transfer molding compound
Plated substrate via
This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.
Die
attach
Wire bonds
Ball bond
Screen-printed
solder mask
Cu substrate traces
DIE
1 mm pitch
Resin glass epoxy
Figure 13. Side View of the PBGA Package Remove
9.1
Package Parameters
Table 22. Package Parameters
Code
VR, ZQ
Type
PBGA
Outline
(mm)
27 x 27
Interconnects
516
Pitch
(mm)
1
Nominal Unmounted
Height (mm)
2.25
This table provides package parameters.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (see
This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free
Packaging Information” (MPC8250PBFREEPKG) available on
www.freescale.com.
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
56
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
