Pressure
Freescale Semiconductor
High Volume Sensor for Low
Pressure Applications
Freescale Semiconductor has developed a low cost, high volume, miniature
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer. This new
chip carrier package uses Freescale Semiconductor's unique sensor die with its
piezoresistive technology, along with the added feature of on-chip, thin-film
temperature compensation and calibration.
NOTE:Freescale
Semiconductor is also offering the Chip Pak package in
application-specific configurations, which will have an “SPX” prefix,
followed by a four-digit number, unique to the specific customer
MPXC2011DT1
Rev 6, 10/2008
MPXC2011DT1
MPXC2012DT1
Pressure Sensors
0 to 75 mmHG
(0 to 10 kPa)
Application Examples
•
•
•
•
Respiratory Diagnostics
Air Movement Control
Controllers
Pressure Switching
Features
•
•
•
•
Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (Medical, Class V Approved)
• Provided in Easy-to-Use Tape and Reel
ORDERING INFORMATION
Device Name
MPXC2011DTI
MPXC2012DTI
Package Options
Tape and Reel
Tape and Reel
Case
No.
423A
423A
Gauge
Pressure Type
Differential
•
•
Absolute
Device Marking
Date Code, Lot ID
Date Code, Lot ID
CHIP PAK PACKAGE
MPXC2011DT1/MPXC2012DT1
CASE 423A-03
NOTE:
The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).
Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices
during all processes.
© Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
