Global Mixed-mode Technology Inc.
(Note 1)
Input Voltage…………………….………….…………8V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature……..…..……..150°C
Storage Temperature Range.……-65°C
≤
T
J
≤+150°C
Reflow Temperature (soldering, 10sec).……….260°C
Thermal Resistance Junction to Ambient
TO-220
(1)
, TO-263
(1)
………………………….…92°C/W
Thermal Resistance Junction to Case
TO-220,TO-263……..……………………………6°C/W
ESD Rating (Human Body Model)………...………2kV
Note
(1)
: See Recommended Minimum Footprint
G1085-XX
Absolute Maximum Ratings
(Note 1)
Input Voltage……….……………………………2.2V~7V
Temperature Range…………….….-40°C
≤
T
A
≤85°C
Operating Conditions
Electrical Characteristics
V
IN
= 5V, C
IN
= C
OUT
= 220µF, T
A
= T
J
= 25°C unless otherwise specified. (Note3)
PARAMETER
CONDITION
MIN
Output Voltage
Line Regulation
Load Regulation
10mA < I
OUT
< 3A
(V
OUT
+ 0.7V) < V
IN
< 5.5V, I
OUT
= 10mA
G1085-18 V
IN
=3.8V, 10mA < I
OUT
< 3A
G1085-25 V
IN
=5V, 10mA < I
OUT
< 3A
G1085-33 V
IN
=5V, 10mA < I
OUT
< 3A
G1085-18
∆V
OUT
= 2%, I
OUT
= 3A
G1085-25
∆V
OUT
= 2%, I
OUT
= 3A
G1085-33
∆V
OUT
= 2%, I
OUT
= 3A
(V
IN
- V
OUT
) = 2V
-2%
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0.5
0.5
0.5
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TYP
V
O
0.1
1
1
0.8
0.65
5.5
1
1.7
2.1
2.4
50
92
92
6
6
150
MAX
2%
1
2
1.2
1
0.85
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5
5
5
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UNIT
V
%
%
Dropout Voltage
Current Limit
Short Circuit Current
Quiescent Current
V
A
A
mA
dB
°C/W
°C/W
°C
G1085-18 V
IN
= 5V
G1085-25 V
IN
= 5V
G1085-33 V
IN
= 5V
f = 120Hz, C
OUT
= 10µF Tantalum,
Ripple Rejection
(V
IN
- V
OUT
) = 3V, I
OUT
= 1A
Thermal Resistor Junction-to-Ambient TO-220; Recommended Minimum Footprint
(No heat sink; No air flow)
TO-263; Recommended Minimum Footprint
TO-220
Thermal Resistance Junction-to-Case
TO-263
Thermal Shutdown
Junction Temperature
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions
are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed
specifications and test conditions see the Electrical Characteristics.
Note2:
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal resistance,
θ
JA
, and ambient temperature T
A
. The maximum allowable power dissipation at any ambient temperature is
T
jmax
-T
A
/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into ther-
mal shutdown.
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against fur-
ther reductions in input voltage. Measured when the
output drops 2% below its nominal value. Dropout volt-
age is affected by junction temperature, load current
and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input volt-
age. The measurement is made under conditions of low
dissipation or by using pulse techniques such that av-
erage chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Ver: 0.5 Preliminary
Nov 12, 2004
TEL: 886-3-5788833
http://www.gmt.com.tw
2
GMT [ GLOBAL MIXED-MODE TECHNOLOGY INC ]
