SURFACE MOUNT DEVICE LED
REV:A / 0
Part No. : 0805KRCT
ꢀ Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Bin Code
Min
16.0
25.0
40.0
Max
32.0
50.0
80.0
M
N
P
Including test tolerance
ꢀCAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household application).Consult HB’s sales in advance
for information on application in which exceptional quality and reliability are required, particularly
when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes,
automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. The LEDs should be used within a
year.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
DRAWING NO. : DS-72-03-0008
DATE : 2003-12-12
PAGE 8
HB [ HB ELECTRONIC COMPONENTS ]
