520MR2C 参数 Datasheet PDF下载

LED

ySOLDERING

METHOD

LAMP APPLICATION

SOLDERING CONDITIONS

REMARK

y

Solder no closer than 3mm from the

base of the package

y

Using soldering flux,” RESIN FLUX”

is recommended.

y

During soldering, take care not to

press the tip of iron against the

DIP

SOLDERING

Bath temperature: 260±5

Immersion time: with 5 sec

Soldering iron: 30W or smaller

lead.

SOLDERING

Temperature at tip of iron: 260 or lower (To prevent heat from being

IRON

Soldering time: within 5 sec.

transferred directly to the lead, hold

the lead with a pair of tweezers

while soldering

1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),

be careful not to stress the leads with iron tip.

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2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.

/HDG ZULHV

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