VER:2.0
FR4 Package Outlines（all measures in mm）
This document may contain preliminary information and is subject to
change by Hope Microelectronics without notice. Hope Microelectronics
assumes no responsibility or liability for any use of the information
contained herein. Nothing in this document shall operate as an express or
HOPE MICROELECTRONICS CO.,LTD
4/F, Block B3, East Industrial Area,
Huaqiaocheng, Shenzhen, Guangdong,
China
Tel:
Fax:
Email:
86-755-82973805
86-755-82973550
http://www.hoperf.cn
©2006, HOPE MICROELECTRONICS CO.,LTD. All rights reserved.
implied license or indemnity under the intellectual property rights of Hope
Microelectronics or third parties. The products described in this document
are not intended for use in implantation or other direct life support
applications where malfunction may result in the direct physical harm or
injury to persons. NO WARRANTIES OF ANY KIND, INCLUDING, BUT
NOT LIMITED TO, THE IMPLIED WARRANTIES OF MECHANTABILITY
OR FITNESS FOR A ARTICULAR PURPOSE, ARE OFFERED IN THIS
DOCUMENT.
Website:
Tel: +86-755-82973805
Fax: +86-755-82973550
- 3 -
E-mail: sales@hoperf.com
http://www.hoperf.cn
HOPERF [ Hope Microelectronics co., Ltd ]
