Regulatory Information
Solder Reflow Temperature Profile
The devices contained in this
data sheet have been approved by
the following organizations:
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
UL
PEAK
TEMP.
230°C
Approval under UL 1577,
Component Recognition
Program, File E55361.
200
100
0
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
200°C
30
160°C
150°C
140°C
SEC.
30
SEC.
CSA
3°C + 1°C/–0.5°C
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
IEC/EN/DINEN60747-5-2
0
50
100
150
200
250
Approved under:
TIME (SECONDS)
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAKTEMPERATURE
t
p
20-40 SEC.
260 +0/-5 °C
T
T
p
217 °C
L
RAMP-UP
3 °C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
150 - 200 °C
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 °C, T = 150 °C
T
smax
smin
4
HP [ HEWLETT-PACKARD ]
