IN74HCT139A
MAXIMUM RATINGS*
Symbol
Parameter
Value
-0.5 to +7.0
-1.5 to VCC +1.5
-0.5 to VCC +0.5
±20
Unit
V
VCC
VIN
VOUT
IIN
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
V
V
mA
mA
mA
mW
IOUT
ICC
DC Output Current, per Pin
±25
DC Supply Current, VCC and GND Pins
±50
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
Tstg
TL
Storage Temperature
-65 to +150
260
°C
°C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
4.5
0
Max
5.5
Unit
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
VIN, VOUT
TA
VCC
+125
500
V
-55
0
°C
ns
tr, tf
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
V
OUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
Rev. 00
IKSEMICON [ IK SEMICON CO., LTD ]
