Preliminary
SIDC30D120E6
Fast switching diode chip in EMCON-Technology
FEATURES:
•
1200V EMCON technology 130 µm chip
•
soft, fast switching
•
low reverse recovery charge
•
small temperature coefficient
A
This chip is used for:
•
EUPEC power modules and
discrete devices
Applications:
•
SMPS, resonant applications,
drives
C
Chip Type
SIDC30D120E6
V
R
1200V
I
F
35A
Die Size
5.5 x 5.5 mm
2
Package
sawn on foil
Ordering Code
Q67050-A4125-
A001
MECHANICAL PARAMETER:
Raster size
Area total / active
Anode pad size
Thickness
Wafer size
Flat position
Max. possible chips per wafer
Passivation frontside
Anode metallisation
Cathode metallisation
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
5.5 x 5.5
30.25 / 23.33
4.78 x 4.78
130
150
180
482 pcs
Photoimide
3200 nm AlSiCu
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al,
≤500µm
∅
0.65mm ; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
µm
mm
deg
mm
2
Edited by INFINEON Technologies AI PS DD HV3, L 4182P, Edition 1, 8.01.2002
INFINEON [ INFINEON TECHNOLOGIES AG ]
