IN74HC221A
CHIP PAD DIAGRAM IZ74HC221A
2.1
±
0.03
15
14
13
12
11
10
Chip marking
15HC221
(x=0.140, y=0.884)
1
08
02
(0,0)
03
04
05
06
07
Pad size 0.106 x 0.106 mm (Pad size is given as per passivation layer)
Thickness of chip 0,46±0,02 mm
Pad No
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
Symbol
1A
1B
1RESET
1Q
2Q
2C
EXT
2R
EXT
/C
EXT
GND
2A
2B
2RESET
2Q
1Q
1C
EXT
1R
EXT
/C
EXT
V
CC
PAD LOCATION
X
0.152
0.157
0.458
0.715
1.310
1.585
1.836
1.847
1.836
1.837
1.536
1.278
0.684
0.408
0.158
0.147
Y
0.419
0.132
0.134
0.122
0.122
0.122
0.132
0.690
1.275
1.562
1.560
1.572
1.572
1.572
1.562
1.004
7
1.8
±
0.03
16
09