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PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
WORD-WIDE
4-MBIT (256K X 16), 8-MBIT (512K X 16),
16-MBIT (1024K X 16)
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3
Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V V
PP
Fast Production
Programming
2.7V or 1.8V I/O Option
Reduces Overall System Power
Optimized Block Sizes
Eight 4-KW Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 32-KW Blocks for
Code
High Performance
2.7V–3.6V: 120 ns Max Access Time
Block Locking
V
CC
-Level Control through WP#
Low Power Consumption
20 mA Maximum Read Current
Absolute Hardware-Protection
V
PP
= GND Option
V
CC
Lockout Voltage
Extended Temperature Operation
–40°C to +85°C
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Supports Code Plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
Extended Cycling Capability
10,000 Block Erase Cycles
Automated Word Program and Block
Erase
Command User Interface
Status Registers
SRAM-Compatible Write Interface
Automatic Power Savings Feature
Reset/Deep Power-Down
1 µA I
CC
Typical
Spurious Write Lockout
Standard Surface Mount Packaging
48-Ball
µBGA*
Package
48-Lead TSOP Package
Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
ETOX™ V (0.4
µ)
Flash Technology
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The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide
products will be available in 48-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp.
May 1997
Order Number: 290580-002
INTEL [ INTEL CORPORATION ]
