EL1517
Pinouts
EL1517
(8-PIN SO)
TOP VIEW
OUTA 1
INA- 2
INA+ 3
GND 4
-
+
-
+
8 VS
7 OUTB
6 INB-
5 INB+
NC 1
INA- 2
INA+ 3
V
S
-*
EL1517
(16-PIN QFN)
TOP VIEW
13 OUTB
12 NC
11 INB-
10 INB+
9 C1
NC 5
NC 6
VS- 7
C0 8
16 OUTA
14 VS+
15 NC
EL1517
(10-PIN HMSOP)
TOP VIEW
VS+ 1
NC 2
OUTA 3
INA- 4
INA+ 5
GND*
10 OUTB
9 INB-
8 INB+
7 C1
6 C0
GND 4
THERMAL PAD MUST BE CONNECTED TO NEGATIVE SUPPLY: V
S
-.
QFN PACKAGE CAN BE USED IN DUAL SUPPLY APPLICATIONS.
THERMAL PAD MUST BE CONNECTED TO GROUND.
PAD IS CONNECTED INTERNALLY TO V
S
- AND THUS HMSOP
PACKAGE CAN ONLY BE USED IN SINGLE SUPPLY APPLICATIONS.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
2
INTERSIL [ INTERSIL CORPORATION ]
