EL5173, EL5373
Typical Performance Curves
(Continued)
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
POWER DISSIPATION (W)
1
0.8
870mW
625mW
QSOP24
θ
JA
=115°C/W
SO8
θ
JA
=160°C/W
0.6
0.4 486mW
0.2
0
MSOP8
θ
JA
=206°C/W
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 19. DISABLED RESPONSE
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
1.4
POWER DISSIPATION (W)
1.2
1
0.8
0.6
0.4
0.2
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.136W
909mW
870mW
MSOP8/10
θ
JA
=115°C/W
QSOP24
θ
JA
=88°C/W
SO8
θ
JA
=110°C/W
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
8
FN7312.4
February 16, 2005
INTERSIL [ INTERSIL CORPORATION ]
