EL5174, EL5374
Typical Performance Curves
(Continued)
M = 400ns, CH1 = 500mV/DIV, CH2 = 5V/DIV
0.5V/DIV
CH1
CH2
10ns/DIV
400ns/DIV
FIGURE 19. LARGE SIGNAL TRANSIENT RESPONSE
FIGURE 20. ENABLED RESPONSE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.010W
QSOP28
θ
JA
=99°C/W
625mW
0.6
0.4
0.2
0
SO8
θ
JA
=160°C/W
M = 400ns, CH1 = 200mV/DIV, CH2 = 5V/DIV
1.2
POWER DISSIPATION (W)
1
0.8
CH1
CH2
0
25
50
75 85 100
125
150
400ns/DIV
AMBIENT TEMPERATURE (°C)
FIGURE 21. DISABLED RESPONSE
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.266W
909mW
1.4
POWER DISSIPATION (W)
1.2
1
0.8
0.6
0.4
0.2
0
QSOP28
θ
JA
=79°C/W
SO8
θ
JA
=110°C/W
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
9
FN7313.5
August 8, 2005
INTERSIL [ INTERSIL CORPORATION ]
