EL7586, EL7586A
Typical Performance Curves
(Continued)
V
BOOST
V
LOGIC
V
OFF
V
ON
C
DLY
=220nF
V
BOOST_DELAY
V
LOGIC
V
OFF
V
ON
TIME (10ms/DIV)
C
DLY
=220nF
TIME (10ms/DIV)
FIGURE 19. EL7586A START-UP SEQUENCE
FIGURE 20. EL7586A START-UP SEQUENCE
V
IN
=5V
V
OUT
=13V
I
OUT
=30mA
TIME (400ns/DIV)
V
IN
=5V
V
OUT
=13V
I
OUT
=200mA
TIME (400ns/DIV)
FIGURE 21. LX WAVEFORM - DISCONTINUOUS MODE
FIGURE 22. LX WAVEFORM - CONTINUOUS MODE
0.8
POWER DISSIPATION (W)
JEDEC JESD51-3 AND SEMI G42-88 (SINGLE
LAYER) TEST BOARD
3
POWER DISSIPATION (W)
2.5
2
1.5
1
0.5
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
2.500W
(4 Q
m F
m N
2
JA
=4 x 4 0
m
0°
C m)
/W
0.7 667mW
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100
125
150
(4 Q
m F
J A
m x N2
0
=1
50 4m
m
°C
/W )
θ
θ
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 24. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
8
FN9210.1
October 7, 2005
INTERSIL [ INTERSIL CORPORATION ]
