HIN202E thru HIN241E
Die Characteristics
DIE DIMENSIONS:
128 mils x 77 mils
METALLIZATION:
Type: Al
Thickness: 10k
Å
±1k
Å
SUBSTRATE POTENTIAL
GND
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8k
Å
Silox Thickness: 7k
Å
TRANSISTOR COUNT:
185
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN232E
V-
PIN 6
C2-
PIN 5
C2+
PIN 4
C1-
PIN 3
PIN 2 V+
T2
OUT
PIN 7
PIN 1 C1+
R2
IN
PIN 8
T3
OUT
PIN 9
PIN 17 V
CC
R2
OUT
PIN 10
PIN 11
T2
IN
PIN 12
T1
IN
PIN 13
R1
OUT
PIN 14
R1
IN
PIN 15
T1
OUT
PIN 16
GND
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
3-15
INTERSIL [ INTERSIL CORPORATION ]
