HIN232 thru HIN241
Absolute Maximum Ratings
V
CC
to Ground . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
CC
< 6V
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V
CC
-0.3V) < V+ < 13.2V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V
IN
< (V+ +0.3V)
R
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±30V
Output Voltages
T
OUT
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
TXOUT
< (V+ +0.3V)
R
OUT
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
RXOUT
< (V+ +0.3V)
Short Circuit Duration
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
R
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Thermal Information
Thermal Resistance (Typical, Note 3)
θ
JA
(
o
C/W)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC, SSOP, MQFP - Lead Tips Only)
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be
≤0.1µF.
3.
θ
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
CC
Test Conditions: V
CC
= +5V
±10%,
T
A
= Operating Temperature Range
TEST CONDITIONS
MIN
TYP
MAX
UNITS
No Load,
T
A
= 25
o
C
HIN232
HIN236-238, HIN240-241
HIN239
-
-
-
-
-
5
7
0.4
5.0
1
10
15
1
15
10
mA
mA
mA
mA
µA
V+ Power Supply Current, I
CC
No Load, T
A
= 25
o
C
Shutdown Supply Current, I
CC
(SD)
No Load,
T
A
= 25
o
C
T
A
= 25
o
C
HIN239
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
lL
Input Logic High, V
lH
T
IN
, EN, Shutdown
T
IN
EN, Shutdown
Transmitter Input Pullup Current, I
P
TTL/CMOS Receiver Output Voltage Low, V
OL
TTL/CMOS Receiver Output Voltage High, V
OH
RECEIVER INPUTS
RS-232 Input Voltage Range V
IN
Receiver Input Impedance R
IN
Receiver Input Low Threshold, V
lN
(H-L)
Receiver Input High Threshold, V
IN
(L-H)
Receiver Input Hysteresis V
HYST
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
R
L
= 3kΩ
120
-
-
kbps
V
IN
=
±3V
V
CC
= 5V, T
A
= 25
o
C
V
CC
= 5V, T
A
= 25
o
C
-30
3.0
0.8
-
0.2
-
5.0
1.2
1.7
0.5
+30
7.0
-
2.4
1.0
V
kΩ
V
V
V
T
IN
= 0V
I
OUT
= 1.6mA
I
OUT
= -1.0mA
-
2.0
2.4
-
-
3.5
-
-
-
15
0.1
4.6
0.8
-
-
200
0.4
-
V
V
V
µA
V
V
7
INTERSIL [ INTERSIL CORPORATION ]
