HIP6601A, HIP6603A, HIP6604
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V
BOOT
- V
PHASE
) . . . . . . . . . . . . . . . . . . . . . . .15V
Input Voltage (V
PWM
) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . .V
PHASE
- 5V(<400ns pulse width) to V
BOOT
+ 0.3V
. . . . . . . . . . . V
PHASE
- 3.0V(>400ns pulse width) to V
BOOT
+ 0.3V
LGATE . . . . . . . . . GND - 5V(<400ns pulse width) to V
PVCC
+ 0.3V
. . . . . . . . . . . . . . GND - 3.0V(>400ns pulse width) to V
PVCC
+ 0.3V
PHASE. . . . . . . . . . . . . . . . . .GND - 5V(<400ns pulse width) to 15V
. . . . . . . . . . . . . . . . . . . . . . GND - 0.3V(>400ns pulse width) to 15V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . .3kV
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . .200V
Thermal Information
Thermal Resistance
SOIC Package (Note 1)
θ
JA
(
o
C/W)
97
θ
JC
(
o
C/W)
N/A
EPSOIC Package (Note 2). . . . . . . . . .
38
N/A
QFN Package (Note 2). . . . . . . . . . . . .
48
10
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . 0
o
C to 85
o
C
Maximum Operating Junction Temperature . . . . . . . . . . . . . 125
o
C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
±10%
Supply Voltage Range, PVCC . . . . . . . . . . . . . . . . . . . . . 5V to 12V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
θ
JC,
the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
PARAMETER
VCC SUPPLY CURRENT
Bias Supply Current
Upper Gate Bias Current
POWER-ON RESET
VCC Rising Threshold
VCC Falling Threshold
PWM INPUT
Input Current
PWM Rising Threshold
PWM Falling Threshold
UGATE Rise Time
LGATE Rise Time
UGATE Fall Time
LGATE Fall Time
Recommended Operating Conditions, Unless Otherwise Noted
SYMBOL
I
VCC
I
PVCC
TEST CONDITIONS
HIP6601A, f
PWM
= 1MHz, V
PVCC
= 12V
HIP6603A, f
PWM
= 1MHz, V
PVCC
= 12V
HIP6601A, f
PWM
= 1MHz, V
PVCC
= 12V
HIP6603A, f
PWM
= 1MHz, V
PVCC
= 12V
MIN
-
-
-
-
9.7
9.0
I
PWM
V
PWM
= 0 or 5V (See Block Diagram)
-
3.45
-
t
RUGATE
t
RLGATE
t
FUGATE
t
FLGATE
t
PDLUGATE
t
PDLLGATE
V
PVCC
= 12V, 3nF Load
V
PVCC
= 12V, 3nF Load
V
PVCC
= 12V, 3nF Load
V
PVCC
= 12V, 3nF Load
V
PVCC
= 12V, 3nF Load
V
PVCC
= 12V, 3nF Load
-
-
-
-
-
-
1.4
-
R
UGATE
R
UGATE
I
LGATE
V
PVCC
= 5V
V
PVCC
= 12V
V
PVCC
= 5V
V
PVCC
= 12V
V
PVCC
= 5V, HIP6603A
V
PVCC
= 12V, HIP6603A
V
PVCC
= 5V or 12V, HIP6601A
-
-
-
-
400
500
500
-
TYP
4.4
2.5
200
1.8
9.95
9.2
500
3.6
1.45
20
50
20
20
30
20
-
230
1.7
3.0
2.3
1.1
580
730
730
1.6
MAX
6.2
3.6
430
3.3
10.4
9.5
-
-
1.55
-
-
-
-
-
-
3.6
-
3.0
5.0
4.0
2.0
-
-
-
4.0
UNITS
mA
mA
µA
mA
V
V
µA
V
V
ns
ns
ns
ns
ns
ns
V
ns
Ω
Ω
Ω
Ω
mA
mA
mA
Ω
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
Shutdown Window
Shutdown Holdoff Time
OUTPUT
Upper Drive Source Impedance
Upper Drive Sink Impedance
Lower Drive Source Current
Lower Drive Sink Impedance
R
LGATE
V
PVCC
= 5V or 12V
4
INTERSIL [ INTERSIL CORPORATION ]
