HIP6601B, HIP6603B, HIP6604B
Small Outline Exposed Pad Plastic Packages (EPSOIC)
N
INDEX
AREA
H
E
-B-
1
2
3
0.25(0.010) M
B M
M8.15B
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
INCHES
SYMBOL
A
A1
B
L
SEATING PLANE
-A-
D
-C-
A
h x 45
o
MILLIMETERS
MIN
1.43
0.03
0.35
0.19
4.80
3.31
5.84
0.25
0.41
8
8°
0°
-
-
8°
2.387
2.387
MAX
1.68
0.13
0.49
0.25
4.98
3.39
6.20
0.41
0.64
NOTES
-
-
9
-
3
4
-
-
5
6
7
-
11
11
Rev. 3 6/05
MIN
0.056
0.001
0.0138
0.0075
0.189
0.150
0.230
0.010
0.016
8
0°
-
-
MAX
0.066
0.005
0.0192
0.0098
0.196
0.157
0.244
0.016
0.035
TOP VIEW
C
D
E
e
H
h
L
C
0.050 BSC
1.27 BSC
α
A1
0.10(0.004)
e
B
0.25(0.010) M
SIDE VIEW
C A M
B S
N
α
P
P1
NOTES:
0.094
0.094
1
2
3
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
P1
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
N
P
BOTTOM VIEW
9
FN9072.7
July 20, 2005
INTERSIL [ INTERSIL CORPORATION ]
