X9269US24 参数 Datasheet PDF下载

X9269

Ordering Information

PART NUMBER

X9269TS24*

X9269TS24I*

X9269TS24IZ* (Note)

X9269TS24Z* (Note)

X9269TV24

X9269US24*

X9269US24I*

X9269US24IZ* (Note)

X9269US24Z* (Note)

X9269UV24*

X9269UV24I

X9269TS24-2.7*

X9269TS24I-2.7*

X9269TS24IZ-2.7* (Note)

X9269TS24Z-2.7* (Note)

X9269TV24I-2.7

X9269TV24IZ-2.7* (Note)

X9269US24-2.7*

X9269US24I-2.7*

X9269US24IZ-2.7* (Note)

X9269US24Z-2.7* (Note)

X9269UV24-2.7*

X9269UV24I-2.7*

X9269UV24IZ-2.7*

PART

MARKING

X9269TS

X9269TS I

X9269TS ZI

X9269TS Z

X9269TV

X9269US

X9269US I

X9269US ZI

X9269US Z

X9269UV

X9269UV I

X9269TS F

X9269TS G

X9269TS ZG

X9269TS ZF

X9269TV G

X9269TV ZG

X9269US F

X9269US G

X9269US ZG

X9269US ZF

X9269UV F

X9269UV G

X9269UV ZG

50

2.7 to 5.5

100

50

V

CC

LIMITS

(V)

5 ±10%

POTENTIOMETER

ORGANIZATION

(kΩ)

100

TEMP

RANGE

(°C)

0 to +70

PACKAGE

24 Ld SOIC (300 mil)

PKG.

DWG. #

M24.3

M24.3

M24.3

M24.3

MDP0044

M24.3

M24.3

M24.3

M24.3

MDP0044

MDP0044

M24.3

M24.3

M24.3

M24.3

MDP0044

MDP0044

M24.3

M24.3

M24.3

M24.3

MDP0044

MDP0044

MDP0044

-40 to +85 24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

0 to +70

0 to +70

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

24 Ld TSSOP (4.4mm)

24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

0 to +70

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

24 Ld TSSOP (4.4mm)

-40 to +85 24 Ld TSSOP (4.4mm)

0 to +70

24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

-40 to +85 24 Ld TSSOP (4.4mm)

-40 to +85 24 Ld TSSOP (4.4mm)

(Pb-free)

0 to +70

24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

-40 to +85 24 Ld SOIC (300 mil)

(Pb-free)

0 to +70

0 to +70

24 Ld SOIC (300 mil)

(Pb-free)

24 Ld TSSOP (4.4mm)

-40 to +85 24 Ld TSSOP (4.4mm)

-40 to +85 24 Ld TSSOP (4.4mm)

*Add "T1" suffix for tape and reel.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

2

FN8173.4

April 17, 2007