PD -2.468 rev. B 02/99
HFA90NH40
HEXFRED
Features
Reduced RFI and EMI
Reduced Snubbing
Extensive Characterization of
Recovery Parameters
TM
Ultrafast, Soft Recovery Diode
LUG
TERMINAL
ANODE
V
R
= 400V
V
F
(typ.)
= 1V
d
a
I
F(AV)
= 90A
Q
rr
(typ.) = 420nC
I
RRM
(typ.) = 9.3A
t
rr
(typ.) = 36ns
di
(rec)M
/dt (typ.)
= 260A/µs
BASE CATHODE
Description
HEXFRED diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
TM
HALF-PAK
Absolute Maximum Ratings (per Leg)
Parameter
V
R
I
F
@ T
C
= 25°C
I
F
@ T
C
= 100°C
I
FSM
E
AS
P
D
@ T
C
= 25°C
P
D
@ T
C
= 100°C
T
J
T
STG
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current
Non-Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Max.
400
170
84
600
1.4
310
125
-55 to +150
Units
V
A
mJ
W
°C
Thermal - Mechanical Characteristics
Parameter
R
thJC
R
thCS
Wt
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Weight
Mounting Torque
Terminal Torque
Vertical Pull
2 inch Lever Pull
Note:
Limited by junction temperature
L = 100µH, duty cycle limited by max T
J
125°C
Min.
15 (1.7)
30 (3.4)
Typ.
0.15
26 (0.9)
Max.
0.40
25 (2.8)
40 (4.6)
35
35
Units
°C/W
K/W
g (oz)
lbfin
(Nm)
lbfin
Mounting surface must be smooth, flat, free or burrs or other
protrusions. Apply a thin even film or thermal grease to mounting
surface. Gradually tighten each mounting bolt in 5-10 lbfin steps
until desired or maximum torque limits are reached. Module
1
IRF [ INTERNATIONAL RECTIFIER ]
