Axial Lead & Cartridge Fuses
5×20 mm > Fast-Acting > 216 Series
Soldering Parameters - Wave Soldering
300
Recommended Process Parameters:
Wave Parameter
Preheat:
100
°
C
150
°
C
60-180 seconds
Solder Pot Temperature:
Solder Dwell Time:
260
°
C Maximum
2-5 seconds
Lead-Free Recommendation
Temperature (°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Recommended Hand-Solder Parameters:
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Note: These devices are not recommended for IR or
Convection Reflow process.
Product Characteristics
Body: Ceramic
Material
Filler (160mA-16A): Sand
Terminal Strength
Solderability
Product Marking
Salt Spray
reel)
Condition A
Reference IEC 60127 Second
Edition 2003-01 Annex A
Thermal Shock
Vibration
Condition B: (5 cycles –65
°
C to
+125
°
C)
Operating Temperature
–55ºC to +125ºC
Humidity
°
C) for 240
Packaging
Condition B
© 2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/216.html for current information.
216 Series
216 Series
LITTELFUSE [ LITTELFUSE ]
