Axial Lead & Cartridge Fuses
5×20 mm > Time-Lag > 218 Series
Soldering Parameters - Wave Soldering
300
Temperature
(°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Recommended Process Parameters:
Wave Parameter
Preheat:
(Typical Industry Recommendation)
Lead-Free Recommendation
Temperature Minimum:
Temperature Maximum:
100
°
C
150
°
C
60-180 seconds
260
°
C Maximum
2-5 seconds
Solder Pot Temperature:
Solder Dwell Time:
Time
(Seconds)
Preheat
Time
Dwell
Time
Cooling
Time
Recommended Hand-Solder Parameters:
Note: These devices are not recommended for IR or
Convection Reflow process.
Product Characteristics
Body:
Glass
Cap:
Nickel–plated Brass
Leads:
Tin–plated Copper
Condition A
Reference IEC 60127 Second
Edition 2003-01 Annex A
Cap1:
Brand logo, current and
Product Marking
Cap2:
Salt Spray
Packaging
reel)
Condition B
Vibration
Operating Temperature
Thermal Shock
Terminal Strength
Solderability
–55ºC to +125ºC
Condition B (5 cycles, –65
°
C to
+125
°
C)
Material
Humidity
°
C) for 240
© 2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/218.html for current information.
218 Series
218 Series
LITTELFUSE [ LITTELFUSE ]
