Thin Film > 0603 Size > Very Fast Acting > 434 Series
Surface Mount Fuses
Temperature Rerating Curve
Average Time Current Curves
100
10
TIME IN SECONDS
1
0.1
0.01
0.001
0.1
.25A
.375A
.5A
.68A
.75A
1A
1.5A
2A
2.5A
3A
3.5A
4A
5A
1
10
CURRENT IN AMPERES
100
Soldering Parameters - Wave Soldering
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
250
+0/-5
°C
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
434 Series
32
Revision: February 13, 2008
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for the most current information
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