Gas Discharge Tube (GDT) Products
SL1021A/B, SL1024A/B and PMT8 Series
Time vs. Current for Failsafe
60
30
20
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SL102xA with Failsafe
SL102xB or PMT8 500 Volt Higher Melting Point Solder
SL102xB or PMT8 350 Volt Higher Melting Point Solder
SL102xB or PMT8 90 Volt Higher Melting Point Solder
Voltage vs. Time Characteristic
Max dynamic breakover
voltage
Voltage
(V)
Hold-over voltage
On-State voltage
0.5 1
2
5
10
15
30
0
200
400
600
Time (ns)
800
1000
1200
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
60 – 180 secs
3°C/second max
5°C/second max
217°C
60 – 150 seconds
260
+0/-5
Temperature
200°C
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
°C
10 – 30 seconds
6°C/second max
8 minutes Max.
260°C
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature
(°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
150
160
170
180
190
200
210
220
230
140
240
10
20
30
40
50
60
70
80
90
0
0
Lead-Free Recommendation
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
100
°
C
150
°
C
60-180 seconds
280
°
C Maximum
2-5 seconds
Time
(Seconds)
Preheat
Time
Dwell
Time
Cooling
Time
Note: Surge Arrestors with a Failsafe mechanism should be
individually examined after soldering
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
21
Revised: November 10, 2009
SL1021A/B, SL1024A/B and PMT8 Series
LITTELFUSE [ LITTELFUSE ]
