Figure FS6 Recommended Soldering Temperature Profile for Slow-Blow Chip Fuses
Soldering
10s Max.
260
Natural
Cooling
Temperature (˚C)
230
40s Max.
150-180
Preheat 60 - 120s Min.
Time (s)
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
Maximum temperature of soldering iron tip/soldering time: 350°C /9s or 400°C / 8s.
Table FS7 Tape and Reel Material Characteristics for Slow-Blow Chip Fuses
Tolerance X ± 1mm; 0.X ± 0.5mm; 0.XX ± 0.2mm
Range
Performance
MVR
Vicat softening temperature
Elasticity at break
Testing Method
ASTM D1238
ASTM D1525
ASTM D638
Min.
3.60
97.8
50.0
Max.
4.40
-
-
Table FS8 Tape and Reel Specifications for Slow-Blow Chip Fuses
Dimension in inches (mm)
Mark
E
1
F
W
P
1
P
0
P
2
0603 (1608)
0.069±0.004
0.138±0.002
0.318±0.004
0.157±0.004
0.157±0.004
0.079±0.002
0.059±0.004
-
0.009±0.001
0.036±0.004
0.071±0.004
0.033±0.004
(1.75±0.10)
(3.50±0.05)
(8.00±0.10)
(4.00±0.10)
(4.00±0.10)
(2.00±0.05)
(1.50+0.10/-0.00)
-
(0.23±0.02)
(0.92±0.10)
(1.80±0.10)
(0.85±0.10)
1206 (3216)
0.069±0.004
0.138±0.002
0.318±0.004
0.157±0.004
0.157±0.004
0.079±0.002
0.059±0.004
0.039 max
0.009±0.001
0.071±0.004
0.138±0.004
0.050±0.004
(1.75±0.10)
(3.50±0.05)
(8.00±0.10)
(4.00±0.10)
(4.00±0.10)
(2.00±0.05)
(1.50+0.10/-0.00)
(1.00 max)
(0.23±0.02)
(1.80±0.10)
(3.50±0.10)
(1.27±0.10)
13
D
0
D
1
t
A
0
B
0
K
0
Figure FS7 Taped Component Dimensions for Slow-Blow Chip Fuses
D
0
E
1
P
0
P
2
t
F
W
B
0
K
0
D
1
P
1
A
0
116
RoHS Compliant, ELV Compliant
HF
Halogen Free
MA-COM [ M/A-COM TECHNOLOGY SOLUTIONS, INC. ]
