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MA4E2502L-1246 参数 Datasheet PDF下载

MA4E2502L-1246图片预览
型号: MA4E2502L-1246
PDF下载: 下载PDF文件 查看货源
内容描述: SURMOUNTTM低,中,高垒硅肖特基二极管 [SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes]
分类和应用: 肖特基二极管脉冲
文件页数/大小: 5 页 / 111 K
品牌: MA-COM [ M/A-COM TECHNOLOGY SOLUTIONS, INC. ]
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MA4E2502 Series
SURMOUNT
TM
Low, Medium, and High
Barrier Silicon Schottky Diodes
Features
Extremely Low Parasitic Capitance and Induc-
tance
Surface Mountable in Microwavable Circuits, No
Wirebonds Required
Rugged HMIC Construction with Polyimide
Scratch Protection
Reliable, Multilayer Metalization with a Diffusion
Barrier, 100% Stabilization Bake (300°C, 16
hours)
Lower Susceptibility to ESD Damage
M/A-COM Products
Rev. V7
The MA4E2502 Family of Surmount Schottky di-
odes are recommended for use in microwave cir-
cuits through Ku band frequencies for lower power
applications such as mixers, sub-harmonic mixers,
detectors, and limiters. The HMIC construction
facilitates the direct replacement of more fragile
beam lead diodes with the corresponding Sur-
mount diode, which can be connected to a hard or
soft substrate circuit with solder.
Case Style 1246
Description and Applications
The MA4E2502 SURMOUNT
TM
Series Diodes are
Silicon Low, Medium, and High Barrier Schottky
Devices fabricated with the patented Heterolithic
Microwave Integrated Circuit (HMIC) process.
HMIC circuits consist of Silicon pedestals which
form diodes or via conductors embedded in a glass
dielectric, which acts as the low dispersion, micro-
strip transmission medium. The combination of
silicon and glass allows HMIC devices to have ex-
cellent loss and power dissipation characteristics in
a low profile, reliable device.
The Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of
a beam lead device coupled with the superior me-
chanical performance of a chip. The Surmount
structure employs very low resistance silicon vias
to connect the Schottky contacts to the metalized
mounting pads on the bottom surface of the chip.
These devices are reliable, repeatable, and a lower
cost performance solution to conventional devices.
They have lower susceptibility to electrostatic dis-
charge than conventional beam lead Schottky di-
odes.
The multilayer metallization employed in the fabri-
cation of the Surmount Schottky junctions includes
a platinum diffusion barrier, which permits all de-
vices to be subjected to a 16-hour non-operating
stabilization bake at 300°C.
The “0502” outline allows for Surface Mount place-
ment and multi-functional polarity orientations.
DIM
A
B
C
D Sq.
E
INCHES
MIN.
0.0445
0.0169
0.0040
0.0128
0.0128
MILLIMETERS
MIN.
1.130
0.430
0.102
0.325
0.325
MAX.
0.0465
0.0189
0.0080
0.0148
0.0148
MAX.
1.180
0.480
0.203
0.375
0.375
1
ADVANCED:
Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-
ment to produce in volume is not guaranteed.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.