Figure FF1-FF6
Figure FF5
Family Performance Curves
Figure FF6
... Cont’d
1206SFF Average Time Current Curves
10
A = 0.5A
B = 0.7A
C = 1.0A
D = 1.5A
E = 1.7A
1
F = 2.0A
G = 2.5A
H = 3.0A
I
= 4.0A
10
100
1000
1206SFF I²t vs. t Curves
10000
A =
C =
D =
F =
G =
0.5A
1.0A
1.5A
2.0A
2.5A
H =
I
=
J =
K =
L =
M=
3.0A
4.0A
5.0A
6.0A
7.5A
8.0A
B = 0.75A
A B C D E F G H I JK L M
E = 1.75A
M
L
K
J
I
H
G
F
E
D
C
B
A
Clear-Time (s)
0.1
K = 6.0A
L = 7.0A
M = 8.0A
I²t (A²s)
J = 5.0A
1
0.1
0.01
0.01
0.001
0.1
1
10
100
0.001
0.001
0.01
0.1
1
10
Current (A)
Note:
Curves are nominal
Time (s)
Table FF3 Environmental Specifications for Fast-Acting Chip Fuses
Operating temperature
Mechanical vibration
Mechanical shock
Thermal shock
Resistance to soldering heat
Solderability
Moisture resistance
Salt spray
-55°C to +125°C
Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202
Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202
Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202
11
Table FF4 Material Specifications for Fast-Acting Chip Fuses
Construction body material
Termination material
Fuse element
Ceramic
Silver, Nickel, Tin
Silver
Figure FF7 Thermal Derating Current for Fast-Acting Chip Fuses
Temperature Effect on Current Rating
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
% De-rating
-35
-15
5
25
45
65
85
105
125
145
Maximum Operating Temperature (˚C)
102
RoHS Compliant, ELV Compliant
HF
Halogen Free
MACOM [ Tyco Electronics ]
