AMPMODU Interconnection System
Mod IV Receptacle Assemblies, Single-Row, Outrigger Design
.100 x .100 [2.54 x 2.54] Centerline, End To End Stackable
Dual Entry, End Stackable,
Low Profile, .100 x .100
[2.54 x 2.54] Centerline,
.200 [5.08] Tine Spacing
.125±.010
[3.17±0.25]
Typ.
.020
[0.51]
(Standoffs)
.245
[6.22]
A
.148
[3.77]
Typ.
.107
[2.72]
(Localized Gold
Plate Area)
Point of
Contact
.200±.003
[5.08±0.08]
Typ.
Material and Finish
Housing
— Glass-filled thermoplastic,
black, 94V-0 rated
Plating A
— Duplex .000030 [0.00076]
gold on contact area, .000150-0.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B
— Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C
— .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
.140
[3.56]
.100
[2.54]
Typ.
.053
[1.34]
Typ.
B
.075
+.005
-.000
+0.13
1.90
-.000
Vertical Mount,
Receptacle Assemblies
[
.140
[3.56]
]
.200
[5.08]
.035±.003
Dia.
[0.89±0.08]
.100
[2.54]
Typ.
Recommended PC Board Hole Layout
No. of
Pos.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
30
40
Dimensions
A
.300
[7.62]
.400
[10.16]
.500
[12.70]
.600
[15.24]
.700
[17.78]
.800
[20.32]
.900
[22.86]
1.000
[25.40]
1.100
[27.94]
1.200
[30.48]
1.300
[33.02]
1.400
[35.56]
1.500
[38.10]
1.600
[40.64]
1.700
[43.18]
1.800
[45.72]
1.900
[48.26]
2.000
[50.80]
3.000
[76.20]
4.000
[101.60]
B
.200
[5.08]
.300
[7.62]
.400
[10.16]
.500
[12.70]
.600
[15.24]
.700
[17.78]
.800
[20.32]
.900
[22.86]
1.000
[25.40]
1.100
[27.94]
1.200
[30.48]
1.300
[33.02]
1.400
[35.56]
1.500
[38.10]
1.600
[40.64]
1.700
[43.18]
1.800
[45.72]
1.900
[48.26]
2.900
[73.66]
3.900
[99.06]
Plating A
5-147720-2
5-147720-3
5-147720-4
5-147720-5
5-147720-6
5-147720-7
5-147720-8
5-147720-9
6-147720-0
6-147720-1
6-147720-2
6-147720-3
6-147720-4
6-147720-5
6-147720-6
6-147720-7
6-147720-8
7-147720-8
8-147720-8
8-147720-9
Contact Plating/Part Nos.
Plating B
5-147726-2
5-147726-3
5-147726-4
5-147726-5
5-147726-6
5-147726-7
5-147726-8
5-147726-9
6-147726-0
6-147726-1
6-147726-2
6-147726-3
6-147726-4
6-147726-5
6-147726-6
6-147726-7
6-147726-8
7-147726-8
8-147726-8
8-147726-9
5
Plating C
5-147727-2
5-147727-3
5-147727-4
5-147727-5
5-147727-6
5-147727-7
5-147727-8
5-147727-9
6-147727-0
6-147727-1
6-147727-2
6-147727-3
6-147727-4
6-147727-5
6-147727-6
6-147727-7
6-147727-8
7-147727-8
8-147727-8
8-147727-9
Note:
All part numbers are RoHS
compliant.
Notes:
1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle
assemblies.
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to
the maximum point-of-contact dimension and add .062 [1.57] for recommended board thickness if used in
bottom entry application.
181
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
MACOM [ Tyco Electronics ]
