Signal Relays
P2 Relay V23079
(Continued)
Processing
Recommended soldering conditions
Vapour phase soldering
20 to 40s
240°C
AXICOM
full line: typical
dotted line: process limits
180°C
130°C
external preheating
100°C
forced cooling
Temperature [°C]
Vapour phase soldering
temperature/time profile
(lead and housing peak temp.)
Time [s]
Recommended reflow soldering profile
Infrared soldering
temperature/time profile
(lead and housing peak temp.)
Temperature [°C]
Time [s]
Packing
Reel dimensions
4
10-2013, Rev. 1013
www.te.com
© 2013 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
MACOM [ Tyco Electronics ]
